156 Results.
Showing 1 to 10
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Summary:
Ibis - Intelligence Reporting Function
Sector:
Software Services
Country:
Hong Kong Estimated Cost:
HKD 150350 Notice Type:
Contract Awards
Deadline:
15 Oct 2022
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Summary:
Multi Target Sputtering Machine, 1 Set
Sector:
Technology Hardware and Equipment
Country:
Hong Kong
Notice Type:
Contract Awards
Deadline:
06 Jul 2022
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Summary:
Monolithic Wafer Bonding System,1set
Sector:
Technology Hardware and Equipment
Country:
Hong Kong
Notice Type:
Contract Awards
Deadline:
08 Jun 2022
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Summary:
Automatic Wafer Bonder,1set
Sector:
Technology Hardware and Equipment
Country:
Hong Kong
Notice Type:
Contract Awards
Deadline:
08 Jun 2022
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Summary:
Water Jet Guided Laser Slicing System 1set
Sector:
Technology Hardware and Equipment
Country:
Hong Kong
Notice Type:
Contract Awards
Deadline:
04 Jun 2022
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Summary:
Interactive Finite Element Simulation Analysis Software 1set
Sector:
Software Services
Country:
Hong Kong
Notice Type:
Contract Awards
Deadline:
01 Jun 2022
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Summary:
Purchase One Wafer Bonding And Double-sided Alignment Exposure Machine
Sector:
Technology Hardware and Equipment
Country:
Hong Kong
Notice Type:
Contract Awards
Deadline:
25 May 2022
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Summary:
Printing And Supply Of Name Cards For The Hong Kong Housing Authority
Sector:
Smart Cards and other Access Control system
Country:
Hong Kong Estimated Cost:
HKD 70962 Notice Type:
Contract Awards
Deadline:
31 Jan 2023
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Summary:
Provision Of Services To Conduct The Survey On Performance Of Service Contractors And Routine Maintenance Contractors
Sector:
GIS / GPS
Country:
Hong Kong Estimated Cost:
HKD 536000 Notice Type:
Contract Awards
Deadline:
31 Jan 2023
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Summary:
Engineering Services On Structural And Geotechnical Design For Public Housing Development At Fanling North Area 15 East Phase 1 & Phase 2
Sector:
GIS / GPS
Country:
Hong Kong Estimated Cost:
HKD 16000000 Notice Type:
Contract Awards
Deadline:
31 Jan 2023
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Software Services