Bxinp_2024-03_Framework Agreement For The Provision Of Multi-Project Wafer Manufacturing Services (Mpw) In The Field Of Integrated Circuits For Prototyping Within The Framework Of Research And

Institut Polytechnique de Bordeaux France has Released a tender for Bxinp_2024-03_Framework Agreement For The Provision Of Multi-Project Wafer Manufacturing Services (Mpw) In The Field Of Integrated Circuits For Prototyping Within The Framework Of Research And in . The tender was released on Aug 26, 2024.

Country - France

Summary - Bxinp_2024-03_Framework Agreement For The Provision Of Multi-Project Wafer Manufacturing Services (Mpw) In The Field Of Integrated Circuits For Prototyping Within The Framework Of Research And

Deadline - login to view

IT reference number - 91443256

Product classification - Laboratory services

Organization Details:

  Address - France

  Contact details - 565656565

  Tender notice no. - 76454545

  IT Ref Id - 91443256

  Document Type - Tender Notices

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Notice Details and Documents:

Description - Description: Subject of the contract: BxINP_2024-03_Framework agreement for the provision of multi-project wafer manufacturing (MPW) services in the field of integrated circuits for prototyping within the framework of research and development project s of the IMS laboratory.notice_title: Bxinp_2024-03_Framework Agreement For The Provision Of Multi-Project Wafer Manufacturing Services (Mpw) In The Field Of Integrated Circuits For Prototyping Within The Framework Of Research And.notice_contract_type: Services.local_description: Objet du marché : BxINP_2024-03_Accord-cadre de prestation de services de fabrication de plaquettes multi-projet (MPW) dans le domaine des circuits intégrés pour le p

It Ref Id - 91443256

Deadline - Nov 30, -0001

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