Country - France
Summary - Direct Chip-To-Plate Bonding Equipment With 300Mm High Precision Alignment.
Deadline - login to view
IT reference number - 69173154
Product classification - Microelectronic machinery and apparatus
Address - France
Contact details - 565656565
Tender notice no. - 76454545
IT Ref Id - 69173154
Document Type - Tender Notices
Description - CEA-Leti wishes to acquire a direct chip-to-wafer bonding machine with high precision alignment of less than 0.5µm and high throughput. The machine will have to take the chips from an adhesive film, turn them over, align them and stick them by direc t gluing on a silicon plate 200mm or 300mm in diameter.
It Ref Id - 69173154
Deadline - Nov 30, -0001
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