Dls Superframe

GSI Helmholtz Center for Heavy Ion Research GmbH Germany has Released a tender for Dls Superframe in Technology Hardware and Equipment. The tender was released on Jul 14, 2023.

Country - Germany

Summary - Dls Superframe

Deadline - login to view

IT reference number - 68844124

Product classification - Integrated circuit packages

Organization Details:

  Address - Germany

  Contact details - 565656565

  Tender notice no. - 76454545

  IT Ref Id - 68844124

  Document Type - Tender Notices

Notice Details and Documents:

Description - This RFP covers the fabrication, assembly, testing, certification and transportation of the GSI DLS superframes. The electronic overframes use 19-inch standard mechanics, in which the 19-inch DLS backplane circuit board and a power pack are installed . The DLS superframes accommodate three different modules (printed circuit boards): DLS-ME card, DLS-QA card and DLS-ME-PCFE adapter card. There are two assembly variants for the ME card. With the DLS backplane circuit board, a total of five different assembled circuit boards can be produced. The contractor produces all printed circuit boards of the superframes.

It Ref Id - 68844124

Deadline - Nov 30, -0001

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